Manufacturing
IC & Sensor Packaging Expo Japan - Tokyo
The IC & Sensor Packaging Expo Japan is an exhibition focused on IC final manufacturing, advanced equipment, materials, and services related to IC and sensor packaging technology. It is intended for industry professionals involved in these fields.
The essentials
Event details
- Dates
- 17 February 2027 to 19 February 2027
- Organiser
- RX Japan
- Industry
- Manufacturing
Agenda themes
Topics covered
- electronic design
- R&D
- manufacturing
- semiconductor
- packaging
- pcb
- smt
- Asia
- exhibition
- Japan
Logistics
Where to stay
Places to stay near the venue.
ハイアットリージェンシー東京
新宿区
keio plaza hotel
新宿ワシントンホテル
THE KNOT TOKYO Shinjuku
京王プレッソイン新宿
東急ステイ
パーク ハイアット 東京 ★★★★★
ホテルローズガーデン新宿
Plan this event
Work out who to meet here
Luminik sources the attendee picture for an event like IC & Sensor Packaging Expo Japan - Tokyo, enriches it against your ICP, and sequences it ahead of the date. Capture at the event writes to Salesforce or HubSpot the same day, and attribution ties the pipeline back to the spend.
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