Hardware & IoT

IC & Sensor Packaging Expo Japan - Osaka

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services.

Official websiteRegisterAgenda
9 months until it opens.

The essentials

Event details

Dates
12 May 2027 to 14 May 2027
Location
Intex Osaka, Osaka, Japan
Organiser
RX Japan
Industry
Hardware & IoT

Agenda themes

Topics covered

  • electronic design
  • R&D
  • manufacturing
  • semiconductor
  • packaging
  • pcb
  • smt
  • Asia
  • exhibition
  • Japan

Logistics

Where to stay

Places to stay near the venue.

  • 相鉄フレッサイン

    230 m from the venue

    Map

  • WELCOME INN YODOYABASHI

    260 m from the venue

    Map

  • 御宿 野乃 大阪淀屋橋

    380 m from the venue

    19

    MapHotel site

  • ホテル エルシエント大阪

    530 m from the venue

    MapHotel site

  • リーガプレイス肥後橋

    540 m from the venue

    Map

  • コンラッド大阪 ★★★★★

    550 m from the venue

    4, 大阪市

    MapHotel site

  • Hotel VR Osaka

    620 m from the venue

    23, 大阪市

    MapHotel site

  • ダイワロイネットホテル大阪北浜

    660 m from the venue

    14

    MapHotel site

Plan this event

Work out who to meet here

Luminik sources the attendee picture for an event like IC & Sensor Packaging Expo Japan - Osaka, enriches it against your ICP, and sequences it ahead of the date. Capture at the event writes to Salesforce or HubSpot the same day, and attribution ties the pipeline back to the spend.

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