Manufacturing
IC & Sensor Packaging Expo Japan - Nagoya
The IC & Sensor Packaging Technology Expo is an exhibition focused on advanced equipment, materials, and services for IC final manufacturing. It is intended for industry professionals involved in IC and sensor packaging technology. The event includes a technical conference planned by industry experts.
The essentials
Event details
- Dates
- 25 November 2026 to 27 November 2026
- Organiser
- RX Japan
- Industry
- Manufacturing
Agenda themes
Topics covered
- electronic design
- R&D
- manufacturing
- semiconductor
- packaging
- pcb
- smt
- Asia
- exhibition
- Japan
Logistics
Where to stay
Places to stay near the venue.
androoms
アイリス愛知
KKRホテル名古屋 (KKR Hotel Nagoya)
西鉄ホテルクルーム名古屋
3, 名古屋市
Hotel Vista
R&B Hotel
名鉄イン
レッドプラネットホテル
Plan this event
Work out who to meet here
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