Manufacturing
IC & SENSOR PACKAGING EXPO JAPAN - CHIBA
This exhibition and technical conference focuses on IC final manufacturing. It gathers advanced equipment, materials, and services for IC and sensor packaging technology. The event is for industry professionals.
The essentials
Event details
- Dates
- 9 September 2026 to 11 September 2026
- Organiser
- RX Japan GK NEPCON JAPAN Show Management
- Industry
- Manufacturing
Agenda themes
Topics covered
- electronic design
- R&D
- manufacturing
- semiconductor
- packaging
- pcb
- smt
- Asia
- exhibition
- Japan
Logistics
Where to stay
Places to stay near the venue.
Plan this event
Work out who to meet here
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