Manufacturing
Center for Advanced Materials Processing CMP Symposium (CAMP)
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The 2026 International Symposium on Chemical-Mechanical Planarization (CMP) is a technical event focused on CMP science and technology. It includes invited oral presentations on topics such as slurry development, CMP of various materials, defects, and emerging applications. The event is intended for professionals and researchers in the CMP field.
The essentials
Event details
- Dates
- 2 August 2026 to 5 August 2026
- Organiser
- Clarkson University and the Northern California Chapter of the AVS CMP User Group
- Tickets
- USD 250 to 900
- Industry
- Manufacturing
Agenda themes
Topics covered
- Education & Training
On stage
Speakers
- Dr. Thomas CaulfieldKeynote Speaker, GlobalFoundries
- Yoichi ShiokawaPlenary Speaker, Ebara Corp
- Dr. Uma Rames Krishna LaguduPlenary Speaker
- David HuiQnity
- Jonas BankaitisCorning
- Dan TroolinTSI
- Mevan DissanayakeIBM
- Ravi PalaparthiQnity
- Shay RebohIBM
- Ara PhilipossianAraca
- Jason KeleherLewis University
- Li ZhangQnity
- Takeshi FukumaKanazawa University
- Toshiyuki SanadaShizuoka University
- Douglas NeversMicron
- Sunghoon LeeKCTech
- Michio UnedaGifu University
- Panart KhajornrungruangKyushu Institute of Technology
- Naoyuki HandaEbara Corp
- Matthias StendlerChEmpower
Plan the spend
Tickets
Ticket tiers, as published by the organiser:
| Full Registration | USD 900 |
| Clarkson U. Faculty/Staff Registration | USD 650 |
| Student Registration | USD 250 |
Logistics
Where to stay
Places to stay near the venue.
Lake Placid Inn Boutique Hotel
821 Mirror Lake Drive, Lake Placid, 12946
Hampton Inn & Suites Lake Placid
801 Mirror Lake Drive, Lake Placid, 12946
Eastwind Hotel - Lake Placid
6048 Sentinel Road, Lake Placid, 12946
Best Western Adirondack Inn
2625 Main Street, Lake Placid, 12946-3308
Crowne Plaza Resort & Golf Club
101 Olympic Drive, Lake Placid, 12946
Golden Arrow Lakeside Resort
2559 Main Street, Lake Placid, 12946
Mountain View Inn
Hotel North Woods
Plan this event
Work out who to meet here
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