Manufacturing
Adhesion & Bonding Expo - Osaka
Adhesion & Bonding Expo is an industrial adhesion expo. It presents joining equipment and bonding technologies, including adhesive agents, welding, and dissimilar material joining. This B-to-B trade show is for professionals in industries such as automotive, electronics, and construction.
The essentials
Event details
- Dates
- 12 May 2027 to 14 May 2027
- Location
- Intex Osaka, Osaka, Japan
- Organiser
- RX Japan
- Industry
- Manufacturing
Who attends
The audience
Attendees can explore a wide variety of adhesive agent, test out industrial equipment, and learn from industry experts throughout the technical conference sessions.
As described by the organiser
Agenda themes
Topics covered
- joining equipment
- dissimilar material joining technologies
- materials
- films
- plastics
- ceramics
- metals
- laser technologies
- electronic displays/display technologies
- recycling technologies
- heat technologies
- exhibition
Logistics
Where to stay
Places to stay near the venue.
相鉄フレッサイン
WELCOME INN YODOYABASHI
御宿 野乃 大阪淀屋橋
19
ホテル エルシエント大阪
リーガプレイス肥後橋
コンラッド大阪 ★★★★★
4, 大阪市
Hotel VR Osaka
23, 大阪市
ダイワロイネットホテル大阪北浜
14
Plan this event
Work out who to meet here
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